Aluminum alloy – body die casting, efficient heat dissipation
Self-developed ARM architecture industrial motherboard
RK3588 Octa-core with 6 TOPS NPU
Wide Temperature Adaptation Efficient Heat Dissipation.
Provide SDK package, Support secondary development and upgrade customization
RK3588 Octa Core
Fanless Cooling
DC 12-36V
IP65 Front
SDK Develpment
Android 13
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Product View
The machine features a robustaluminum alloy construction, ensuring durability and structural integrity. It adopts afully enclosed fanless designfor efficient heat dissipation, making it well-suited for operation inchallenging and harsh environments. Equipped with abuilt-in independent NPU, it delivers6TOPS AI computing power, enabling seamlesslightweight AI application development. The system is designed witha fanless, fully sealed structureand afront-panel IP65 dustproof and waterproof rating, providing enhanced protection. Withhigh scalability, strong practicality, and excellent EMC compatibility, this panel PC is optimized for demanding industrial applications.