Aluminum alloy – body die casting, efficient heat dissipation
Self-developed ARM architecture industrial motherboard
RK3588 Octa-core with 6 TOPS NPU
Wide Temperature Adaptation Efficient Heat Dissipation.
Provide SDK package, Support secondary development and upgrade customization
RK3588 Octa Core
Fanless Cooling
DC 12-36V
IP65 Front
SDK Develpment
Android 13
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Product View
The machine features a robust aluminum alloy construction, ensuring durability and structural integrity. It adopts a fully enclosed fanless design for efficient heat dissipation, making it well-suited for operation in challenging and harsh environments. Equipped with a built-in independent NPU, it delivers 6TOPS AI computing power, enabling seamless lightweight AI application development. The system is designed with a fanless, fully sealed structure and a front-panel IP65 dustproof and waterproof rating, providing enhanced protection. With high scalability, strong practicality, and excellent EMC compatibility, this panel PC is optimized for demanding industrial applications.