TouchThink Ruggedized Panel PC for Metal 3D printer

TouchThink smart manufacturing

Industry Application Overview

With disruptive advancements in precision engineering fields such as aerospace, scientific research, healthcare, and automotive manufacturing, the demand for high-strength, high-precision, lightweight, and flexible metal components has become increasingly urgent. 3D printing technology has gradually shifted its focus from polymer materials to metal powder materials. The market scale for metal 3D printers continues to expand, and driven by Industry 4.0 information technologies, it has entered a new phase of intelligent and digital development.

Industry Application Requirements

Metal 3D printing is a precision and high-strength manufacturing process. When selecting and configuring an ruggedized industrial panel PC, it is essential to evaluate standards such as computational power supply and hardware configuration. Additionally, the ruggedized panel PC must ensure reliable performance for extended operation and withstand environmental factors like temperature, humidity, vibration, and voltage fluctuations in specialized settings. Specific requirements include:

  • User-friendly interactive panel supporting high-precision display control operations;
  • Equipped with a high-performance processor supporting sensor control, intensive computing, and data processing;
  • Open-source system compatible with professional 3D printing modeling and slicing software;
  • WiFi or wired networking, supporting remote printing, remote monitoring, and message alerts;
  • Large storage capacity with USB expansion support, enabling storage and export of numerous model files;
  • Designed for harsh industrial environments, supporting long-term stable operation.

System Application Architecture for Metal 3D Printer

System Application Architecture

TouchThink Preferred Ruggedized Panel PC

External-embedded Ruggedized Panel PC (Android) / Industrial Display

  • 3mm ultra-thin high-definition industrial control panel, embedded installation, 10-point capacitive touch
  • Rockchip® RK3568 processor, quad-core/quad-thread, 2.0GHz clock speed
  • ARM open-source architecture, compatible with multiple operating systems, featuring SDK development packages.
  • Up to 8+256GB storage configuration, offer ample capacity & fast speeds.
  • Multiple COM/USB ports for peripheral and sensor expansion.
  • High-speed networking: 1GbE LAN, 4G/5G, Wi-Fi 6, Bluetooth.
  • Wide temperature range (-10°C to 60°C), wide voltage input (12-36V), EMC/ESD protection, vibration resistance.