Aluminum alloy – body die casting, efficient heat dissipation
Self-developed ARM architecture industrial motherboard
RK3588 Octa-core with 6 TOPS NPU
Wide Temperature Adaptation Efficient Heat Dissipation.
Provide SDK package, Support secondary development and upgrade customization
RK3588 Octa Core
Fanless Cooling
DC 12-36V
IP65 Front
SDK Develpment
Android 13
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Product View
The machine is made of aluminum alloy material, strong structure, fully closed without fan design, efficient heat dissipation, designed for a variety of complex harsh environment.built-in independent NPU, with 6TOPS AI computing capability, and supports lightweight AI application development. With a fanless fully enclosed, and front IP65 dustproof & waterproof design. The whole panel PC has high scalability, practicality, and EMC compatibility.